At Boeing, we innovate and collaborate to make the world a better place. We’re committed to fostering an environment for every teammate that’s welcoming, respectful and inclusive, with great opportunity for professional growth. Find your future with us.

Overview

As a leading global aerospace company, Boeing develops, manufactures and services commercial airplanes, defense products and space systems for customers in more than 150 countries. As a top U.S. exporter, the company leverages the talents of a global supplier base to advance economic opportunity, sustainability and community impact. Boeing’s team is committed to innovating for the future, leading with sustainability, and cultivating a culture based on the company’s core values of safety, quality and integrity.

Technology for today and tomorrow

The Boeing India Engineering & Technology Center (BIETC) is a 5500+ engineering workforce that contributes to global aerospace growth. Our engineers deliver cutting-edge R&D, innovation, and high-quality engineering work in global spanets, and leverage new-age technologies such as AI/ML, IIoT, Cloud, Model-Based Engineering, and Additive Manufacturing, shaping the future of aerospace.

People-driven culture

At Boeing, we believe creativity and innovation thrives when every employee is trusted, empowered, and has the flexibility to choose, grow, learn, and explore. We offer variable arrangements depending upon business and customer needs, and professional pursuits that offer greater flexibility in the way our people work. We also believe that collaboration, frequent team engagements, and face-to-face meetings bring together different perspectives and thoughts – enabling every voice to be heard and every perspective to be respected.  No matter where or how our teammates work, we are committed to positively shaping people’s careers and being thoughtful about employee wellbeing.

With us, you can create and contribute to what matters most in your career, community, country, and world. Join us in powering the progress of global aerospace.

Position Overview

The Boeing India Engineering and Technology Center (BIETC) is looking for an Experienced Electronics Packaging Design & Analysis Engineer for a key role in development of a growing business unit.  The position will be a hands-on technical role with responsibility ranging from printed circuit board, chassis, thermal, structural, fatigue and materials to requirements development, detailed design, documentation and analysis. The successful candidate should have a track record of demonstrated successes from previous work assignments.

Position Responsibilities:

• Working on Electronic Line Replaceable Unit design & development for complex electro-mechanical System and components
• Develop mechanical design concepts for chassis, enclosure, PCB mounts to address system requirements, weight, cost and thermal constraints
• Requirements management: Analyzing Customer & System Requirements to develop mechanical design concepts for various avionics Line Replaceable Units.
• Product support: Collaboration with production for technical issue resolution, perform root cause analysis, prepare technical documentation such as RAC, Test procedure, Test Plan, Qual Plan, Service bulletin
• Design Calculations: Perform design calculations, stack up analysis, machined chassis development and support in developing mechanical design concepts.
• Conduct thermal, stress and dynamic analysis to validate designs through testing.
• Validating designs through thermal, dynamic, solder/joint lead fatigue analyses and testing
• Identifying and tracking technical performance metrics to measure progress and ensure compliance with requirements
• Collaborating & communicating with cross functional teams and all stakeholders, especially electronics circuit designers and manufacturing engineers to ensure that the hardware meets imposed customer and derived requirements
• Conduct DO-160 Qualification testing for Structural, Thermal, and other Environmental conditions.
• Executing end-to-end project management, including some configuration management and change control
• Represent Mechanical Engineering in IPT meetings, design reviews, customer meetings, audits and other activities.
• Must be able to work well in domestic and global teams from a modern innovative and collaborative environment.
• Train and mentor other engineers, manage one or more projects.
• Strong problem-solving skills and the ability to proactively think out of the box preferred.

Basic Qualifications (Required Skills/Experience):

• A Bachelor’s degree or higher is required as a BASIC QUALIFICATION
• 9 years of related work experience with Bachelor’s degree or Masters of Engineering with 8+ years of related experience
• Must have Strong Mechanical Product design expertise with a focus on hands on experience in New Product Design and development of Electronic Line Replaceable Unit
• Must understand the complete product development lifecycle, capture requirements and provide technical guidance and decisions.
• Experience in detailed development and COTS selection of power and analog/control electronic printed circuit boards, connectors, modules, chassis, heat sink and mechanical fasteners.
• Experience in requirements capture for printed circuit board (PCB) layout, and electrical interconnect design.
• Experience in Mechanical Chassis design (End-to-End) for Rugged/Sheet metal LRU and test equipment.
• Experience in Heat Sink Design, Fan Selection, Component and System level cooling.
• Experience with static and dynamic structural analysis, solder joint / lead fatigue analysis, thermal analysis (passive and active cooling) and mechanical tolerance analysis.
• Understanding configuration management, requirements traceability (DOORS) and related processes.
• Experience in Aerospace – conducting DO-160 Qualification testing including preparation of Qualification Test Procedure and Reports. 
• Experience supporting design fit checks during integration and test at the module, sub-system and system level.
• Strong technical team leadership and mentoring skills. Ability to coordinate multi-discipline team.
• Strong technical writing and verbal communication skills.
• Experience in using Engineering design tools, specifically, 3D CAD tools such as Creo, NX, Catia/3DX, FloTherm
• Understanding of ASME Y14.5 Geometric Dimensioning and Tolerance Standards

Typical Education & Experience:

Mechanical Engineering degree, 9 to 12 years of related work experience with bachelor’s degree or master’s degree with 8 to 11 years related work experience or an equivalent combination of education and experience

Relocation:

This position offers relocation based on candidate eligibility.

Applications for this position will be accepted until Apr. 26, 2025

Education

Bachelors Degree or Equivalent Required

Relocation

This position offers relocation based on candidate eligibility.

Visa Sponsorship

Employer will not sponsor applicants for employment visa status.

Shift

Not a Shift Worker (India)

Equal Opportunity Employer:

We are an equal opportunity employer. We do not accept unlawful discrimination in our recruitment or employment practices on any grounds including but not limited to; race, color, ethnicity, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military and veteran status, or other characteristics covered by applicable law.

We have teams in more than 65 countries, and each person plays a role in helping us become one of the world’s most innovative, diverse and inclusive companies. We are proud members of the Valuable 500 and welcome applications from candidates with disabilities. Applicants are encouraged to share with our recruitment team any accommodations required during the recruitment process. Accommodations may include but are not limited to: conducting interviews in accessible locations that accommodate mobility needs, encouraging candidates to bring and use any existing assistive technology such as screen readers and offering flexible interview formats such as virtual or phone interviews.